Simple y con Estilo
Posee un diseño elegante con esquinas redondas para un efecto visual atractivo.
Case de Aluminio
Gracias a su case de aluminio es sumamente ligera y resistente al calor. El material de aluminio hace que disipe mucho mejor el calor, manteniendo la computadora a una temperatura ideal en prácticamente cualquier ambiente.
Pequeña y Compacta
La EQ6 no es la excepción de nuestras mini computadoras... como se esperaría de una Mini PC, es pequeña, midiendo solamente 7.8" (Ancho) x 8.8" (Profundidad) x 2.2" (Altura).
Todas las Monix PC son 100% personalizables, a continuación algunas características. Por favor, tenga en cuenta que algunas de estas características puede que no esté disponible en alguno de los Motherboards.
HDMI
The HDMI specification defines the protocols, signals, electrical interfaces, and mechanical requirements of the standard.[39] The maximum pixel clock rate for HDMI 1.0 was 165 MHz, which was sufficient for supporting 1080p and WUXGA (1920×1200) at 60 Hz. HDMI 1.3 increased that to 340 MHz, which allows for higher resolution (such as WQXGA, 2560×1600) across a single digital link.[40] An HDMI connection can either be single-link (Type A/C) or dual-link (Type B) and can have a video pixel rate of 25 MHz to 340 MHz (for a single-link connection) or 25 MHz to 680 MHz (for a dual-link connection). Video formats with rates below 25 MHz (e.g., 13.5 MHz for 480i/NTSC) are transmitted using a pixel-repetition scheme.
Wireless N
IEEE 802.11n is an amendment to IEEE 802.11-2007 as amended by IEEE 802.11k-2008, IEEE 802.11r-2008, IEEE 802.11y-2008, and IEEE 802.11w-2009, and builds on previous 802.11 standards by adding multiple-input multiple-output (MIMO) and 40 MHz channels to the PHY (physical layer), and frame aggregation to the MAC layer.
memoria DDR3
The primary benefit of DDR3 SDRAM over its predecessor, DDR2 SDRAM, is the ability to transfer at twice the data rate (8× the speed of its internal memory arrays), enabling higher bandwidth or peak data rates. In addition, the DDR3 standard allows for chip capacities of up to 8 gigabits, thus enabling a memory module size of 16 gigabytes (using 16 chips).
With two transfers per cycle of a quadrupled clock, a 64-bit wide DDR3 module may achieve a transfer rate of up to 64 times the memory clock in MB/s.
DDR3 memory provides a reduction in power consumption of 30% compared to DDR2 modules due to DDR3's 1.5 V supply voltage, compared to DDR2's 1.8 V or DDR's 2.5 V. The 1.5 V supply voltage works well with the 90 nanometer fabrication technology used in the original DDR3 chips. Some manufacturers further propose using "dual-gate" transistors to reduce leakage of current.
Intel Microarchitecture Based Dual-core Processing
This Intel processor includes dual execution cores in a single processor to enable execution of parallel threads or applications simultaneously, resulting in great dual-core performance, breakthrough energy efficiency and fast system response time when running multi-threaded applications, or multiple demanding applications. The innovative 32nm fabrication technology optimizes thermal performance for reduced power consumption and noise.
Intel HD Graphics
Intel HD Graphics with dynamic frequency up to 1GHz delivers smooth HD video playback and mainstream 3D gaming without the need for add-in video cards or decoders. It also supports a wide range of display connectivity options and is dual display capable.
Intel Smart Cache
Intel Smart Cache Technology dynamically allocates the shared cache to each processor core based on workload. This efficient, multi-core-optimized implementation increases the probability that each core can access data from faster, more efficient cache subsystem resulting in significantly reduced latency for frequently used data and improved performance.
Intel Virtualization Technology
Increasing manageability, security, and flexibility in IT environments, virtualization technologies like hardware-assisted Intel Virtualization Technology (Intel VT) combined with software-based virtualization solutions provide maximum system utilization by consolidating multiple environments into a single server or PC. By abstracting the software away from the underlying hardware, a world of new usage models opens up that reduce costs, increase management efficiency, strengthen security, while making your computing infrastructure more resilient in the event of a disaster.
Enhanced Intel SpeedStep Technology
Enhanced Intel SpeedStep Technology is an advanced means of enabling very high performance while also meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep Technology switches both voltage and frequency in tandem between high and low levels in response to processor load.
Fully integrated Microarchitecture on 32nm Process
The Intel microarchitecture codename Sandy Bridge is an incredible leap in processor integration and manufacturing introduced in the 2nd generation Intel Core processor family. Manufactured entirely on Intel 32nm process technology, Sandy Bridge unifies processor cores, memory controller, last-level cache (LLC), and graphics and media processing. Such tight integration enables a host of performance and efficiency improvements, including fast access by cores and graphics to shared data in the last-level cache to accelerate graphics processing, fewer buses over which data and signaling must travel for faster processing, and more memory bandwidth for the cores to boost system performance.
Intel Hyper-Threading Technology (HT Technology)
Intel Hyper-Threading Technology delivers thread-level parallelism on each processor resulting in more efficient use of processor resources—higher processing throughput—and improved performance on the multi-threaded software of today and tomorrow.
Intel Turbo Boost Technology 2.0
More intelligent, energy-efficient, and dynamic than previous generation, Intel Turbo Boost Technology 2.0 gives you accelerating performance when you need it. It delivers an even greater automatic speed increase by allowing processor cores to run faster than the base operating frequency for demanding applications if the processor is operating below power, current, and temperature specification limits.
Integrated memory controller
Integrated memory controller enables two channels of DDR3 1333/1600 MHz memory, resulting in up to 25.6 GB/sec memory bandwidth. Plus the memory controller's lower latency and higher memory bandwidth delivers amazing performance for data-intensive applications.
USB 3.0 and SATA III
The USB 3.0 technology is natively built into the chipset to provide up to 5Gbps bandwidth for blazing fast data transfer. The SATA III interface enables up to 6Gbps link speed - twice the speed of SATA revision II to take full advantage of the latest SSD storage technology.
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